Functions and Uses：
1. It is the transparent liquid containing organic and inorganic acids.
2. No risk of the copper substrate attack while the workpiece is dipping in the UD-903 solvent up to 30 to 40 minutes.
3. Different from the other chemical polishing processes, UD-903 has almost no impact to the shape and size of the workpiece.
4. Extraordinary lifetime of solution. Very less carry over produces and minimum impact to the environment.
5. Applicable substrate: copper, brass and other chemical polishing copper alloy.
Operating Components：
Density directly use
Temperature: room temperature
Time 10s~40min
1. It is the transparent liquid containing organic and inorganic acids.
2. No risk of the copper substrate attack while the workpiece is dipping in the UD-903 solvent up to 30 to 40 minutes.
3. Different from the other chemical polishing processes, UD-903 has almost no impact to the shape and size of the workpiece.
4. Extraordinary lifetime of solution. Very less carry over produces and minimum impact to the environment.
5. Applicable substrate: copper, brass and other chemical polishing copper alloy.
Operating Components：
Density directly use
Temperature: room temperature
Time 10s~40min
