Functions and Uses：
1. “103 Low stress Ni” is used in the type of sulfuric acid nickel plating process or type of amino sulfonic acid nickel plating process.
2. Low internal stress. The semi bright and superior ductility make the 103 suitable to be the bottom deposit of precious metals and general metals.
3. This process is also suitable for printed circuit boards, semiconductors and other highly reliable electronic devices.
Operating Components：
Nickel ion 50 ~ 120g / L1. “103 Low stress Ni” is used in the type of sulfuric acid nickel plating process or type of amino sulfonic acid nickel plating process.
2. Low internal stress. The semi bright and superior ductility make the 103 suitable to be the bottom deposit of precious metals and general metals.
3. This process is also suitable for printed circuit boards, semiconductors and other highly reliable electronic devices.
Operating Components：
Boric acid 30 ~ 45g / L
103S anode activator 50 ~ 100mL / L
103S supplements 5 ~ 18mL / L
Anode sulfur depolarized nickel or carbon nickel
Temperature 52 ~ 60 ℃
PH 2.5 to 3.5
Current density 1.5 ~ 8.0A / dm2
