Functions and Uses：
1. It is a pure tin process that applicable to the reflow soldering and can be used for the interconnect plating and wire plating.
2. HMM2 can produce the pure tin deposit in the wild acceptability of operating temperature and current density. The produced deposit obtains excellent solderability, superior coverage, and good ductility but less organic content
A-70Acid 70% 100mL/L
Current Density 5~30 A/dm2
Mixing Stir strongly